Qualcomm and MediaTek are preparing their next generation flagship chipsets, and a new leak has revealed details about the Snapdragon 8 Elite Gen 6 Pro and Dimensity 9600 Pro ahead of their official announcements.

According to tipster Digital Chat Station, the Snapdragon 8 Elite Gen 6 Pro, reportedly carrying the SM8975 model number, will be manufactured using TSMC’s new 2nm N2P process. Its CPU is expected to break the 5GHz barrier, with two Prime cores reaching 5.01GHz.

The eight core CPU is reportedly arranged with two cores at 5.01GHz, three at 4.03GHz and three at 3.74GHz. For comparison, the Snapdragon 8 Elite Gen 5 features two cores at 4.61GHz and six at 3.63GHz.

The Dimensity 9600 Pro is also expected to use TSMC’s N2P process, although MediaTek will reportedly rely on Arm designed CPU cores. The configuration is said to include two Canyon cores at 4.55GHz, three Gelas b cores at 4.35GHz and three Gelas cores at 3.10GHz.

The exact Arm core names have not been confirmed, but Canyon is believed to refer to the Arm C2 Ultra, while Gelas b could be the C2 Premium and Gelas may refer to the older C1 Pro.

On the graphics side, the Snapdragon 8 Elite Gen 6 Pro is tipped to use an Adreno 850 GPU with three slices and 18MB of graphics memory. The chipset is also expected to feature 8MB of Last Level Cache.

Qualcomm is reportedly preparing two Snapdragon 8 Elite Gen 6 variants. The standard version, carrying the SM8950 model number, will use a similar 2+3+3 CPU configuration but with undisclosed clock speeds. It is expected to feature the Adreno 845 GPU with two slices, 12MB of graphics memory and 6MB of LLC.

Meanwhile, the Dimensity 9600 Pro is tipped to feature Arm’s G2 Ultra NX MC12 GPU, the same graphics architecture reportedly used by Xiaomi’s Xring O3 chipset.

The GPU is said to contain 16 cores divided into two groups, with eight conventional GPU cores and eight cores equipped with NX tensor acceleration. The latter could assist with features such as image upscaling and frame generation during gaming.

All of these specifications remain unofficial for now, but the leaked details suggest both Qualcomm and MediaTek are preparing major upgrades for their next flagship smartphone platforms.