Xiaomi has officially confirmed that its next foldable smartphone will launch in September, but it won’t be called the Mix Fold 5. Instead, the company is introducing the Xiaomi 18 Fold, which will also be the first smartphone powered by Xiaomi’s new Xring O3 chipset.

The Xring O3 is the successor to last year’s Xring O1 and has already posted an impressive AnTuTu V11 score of 5,228,014 points. Xiaomi claims this is higher than any other smartphone chipset currently available.

The chipset features a 10 core CPU consisting of two C1 Ultra cores clocked at up to 4.35GHz, four C1 Premium cores reaching 3.68GHz and four C1 Pro cores running at up to 3.15GHz.

In Geekbench 6.5, the Xring O3 achieved 3,945 points in the single core test and 15,221 points in the multi core test. Apple’s A19 Pro remains ahead in single core performance, but falls significantly behind the Xring O3 in multi core performance.

The GPU also delivers major gains over the previous Xring O1. Xiaomi’s tests show improvements of 85%, 94% and 182% across three selected benchmarks. The Xring O3 also outperformed Apple’s A19 Pro in all three tests shared by Xiaomi.

The new chipset supports LPDDR6 RAM with bandwidth reaching 113.8GB/s, further improving its memory performance.

With these results, Xiaomi’s custom silicon appears to be becoming a serious competitor to flagship chipsets from Qualcomm, MediaTek and Apple. More details about the Xiaomi 18 Fold should emerge ahead of its September launch.